JTX T4 MAX Phone CPU/EMMC/RAM Glue Removal Reballing Platform JBC Qianli Fire Eye Ultra Thermal

Qianli Fire Eye Ultra Thermal imager can quickly diagnose and detect short circuits

XZZ GL-01 360℃ Rotating Circular Glass Clamp and XZZ GL-02 Square High Temperature Resistant Glass Fixture for Mobile Phone Motherboards CPU Chips Soldering Repair

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can replace the screen of a variety of models

UNI-T Thermal Imager For Smart Phone UTI260M UTI256M 256x192 Pixel Thermographic Camera Thermal Camera PCB Circuit Failure Smartphone Test Tool

JTX T4 MAX Phone CPU/EMMC/RAM Glue Removal Reballing Platform JBC Qianli Fire Eye Ultra ThermalJTXTOOLS T4MAX Glue Removal & Reballing Platform with 17 precision stencils for efficient glue removal and precise tin planting on CPU, EMMC, and RAM chips. Supporting 102 chip models across Apple iPhone, Android, Exynos, Qualcomm, HiSilicon, and Dimensity processors. A powerful magnetic force firmly secures the chip, automatically clamping and aligning it for precise chip placement. It is an essential tool for mobile phone repair technicians