SKU: 88395981814
Ships within 48 hours · Estimated delivery Sep 17 - Sep 22
or replace the heating elements
Four-and-a-half high precision data display
Input voltage: AC 230V/115V±10%
Fast accurately locate the location of high-temperature components
KB-series: KB620
MIJING MS1-MINI Chip Glue Removal Table Heating Platform iPhone accessories or replace the heating elementsMIJING MS1 MINI Chip Glue Removal Table for heating and removing glue from mobile phone CPU RAM, NAND, eMMC, SSD, WIFI, and BGA chips without using hot air gun and soldering iron. Mijing MS1 MINI glue removal desoldering station, rapid heating, one button adjustment, easy and simple operation. Features: Rapid Heating: Adjustable temperature range (160C250C) for precise control. Efficient Heat Conduction: Aluminum substrate ensures fast and even
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