SKU: 47337069725
Ships within 48 hours · Estimated delivery Sep 26 - Oct 1
Working distance: 50~155mm
The latest design defoaming door
Shockproof Foam
Optional Hardware design :
Works with NAND and NOR flash chip type
PHONEFIX 120X Pre-Heating Station for IPhone BGA CPU Desoldering Size:120CC Working distance: 50~155mmPHONEFIX Heating Station + 3 kinds Motherboard Heating groove Features : Brand: PHONEFIX Voltage: 110V 220V Demolition shield temperature adjustment 180 220 In addition to CPU side glue temperature 180 220 Demolition A8 A9 A10 A11CPU the temperature 230 240 Desmearing temperature 180 200 Reballing BGA chip temperature 180 200 Soldering A8 A9 A10 A11 CPU temperature 190 210 Optional Types : 120X MAX ( 3 IN 1 ) for iPhone X XS XS MAX Double Layers Board
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